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Electronic Optical Laser Cutting Machine CT-8080
Adopting galvanometer scanning cutting, this machine provides flexible laser and power options. It delivers stable high-precision fine cutting for fragile optical materials and precision electronic parts.
- Overview
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Adopting galvanometer scanning cutting, this machine provides flexible laser and power options. It delivers stable high-precision fine cutting for fragile optical materials and precision electronic parts.
Product Parameters
Machine name |
Laser cutting machine |
Model |
CT-8080 |
Cutting range |
800*800mm |
Thickness of processable material |
≤3mm |
Platform repeatability |
±2μm |
Comprehensive precision |
±5μm |
Laser type |
UV picosecond, infrared picosecond, UV nanosecond, green light optional |
Laser power |
Power optional (3-30W) |
Cooling method |
Chiller |
Cutting method |
Scanning cut by vibrating mirror + lens |
Maximum cutting accuracy |
±0.03mm |
CCD resolution |
500W (optional) |
X-axis travel |
900mm |
Y-axis travel |
1100mm |
Z-axis travel |
100mm |
Maximum X/Y single-axis speed |
1000mm/s |
Working mode |
Manual loading and unloading |
Industrial vacuum system |
Standard |
File Format |
dxf format |
Cutting system |
SMIDA |
Main equipment power supply voltage |
220V/50Hz |
Working height |
900±30mm |
Industrial vacuum power supply |
220V/50Hz |
Equipment external size |
L1600*W1800*H2000mm |
Working environment |
Temperature: 25℃±2℃; humidity≤60%; no condensation |
Weight |
800kg |
Total power |
5.5kW |
Product Advantages
The machine is configured with a high-speed scanning galvanometer, and its X/Y working platform applies a gantry framework, marble substrate and flying optical path structure, ensuring exceptional stability and consistent precision in long-term running.
Offers flexible selections of laser sources including picosecond UV, nanosecond UV and nanosecond green lasers, all with superior beam performance, tiny spots, fine kerfs and high processing accuracy. The optimal laser solution can be configured to maximize production efficiency on the premise of qualified processing results.
Comes with high-resolution industrial-grade CCD and high-quality lenses, achieving intelligent and high-precision auto-positioning and auto-focusing. It is compatible with diverse visual positioning features to meet different precision processing requirements.
Features automatic galvanometer calibration and intelligent focus adjustment. With a laser displacement sensor, it can adaptively adjust the focus height to the platform, realizing quick and accurate alignment and simplifying the entire operation flow.
Integrated waste gas suction and purification system thoroughly absorbs and treats cutting fumes and harmful gases, safeguarding the health of operators and meeting eco-friendly industrial production standards.
Product Application
Cutting of glass backlight panel, direct light panel, glass paint removal, electronic components, sapphire, camera module, glass enclosure, fingerprint module stainless steel reinforcement sheet, communication products, PCB (PCBA), FPC, aluminum substrate and other materials.
FAQ
Q: What industries is this laser cutting machine applied in?
A: It is mainly used in consumer electronics, optical display, PCB manufacturing, semiconductor and communication industries.
Q: What materials can this machine process?
A: It can perform precision processing on glass, sapphire, PCB, FPC, electronic components, metal sheets and etc.
Q: What about the machine’s laser configuration?
A: Multiple laser types are optional, and the laser power is adjustable to fit different processing demands.
