EN
High-Precision Ultrafast Laser Cutting Machine CT-5050
This high-precision laser micro-cutter supports customizable picosecond and nanosecond lasers, with micron-level cutting accuracy. It is used for precision processing of glass, optical parts, sapphire, PCB, FPC and micro electronic components.
- Overview
- Recommended Products
This high-precision laser micro-cutter supports customizable picosecond and nanosecond lasers, with micron-level cutting accuracy. It is used for precision processing of glass, optical parts, sapphire, PCB, FPC and micro electronic components.
Product Parameters
Machine name |
Laser cutting machine |
Model |
CT-5050 |
Cutting range |
500*500mm |
Thickness of processable material |
≤3mm |
Platform repeatability |
±2μm |
Comprehensive precision |
±5μm |
Laser type |
UV picosecond, infrared picosecond, UV nanosecond, green light optional |
Laser power |
Power optional (3-30W) |
Cooling method |
Chiller |
Cutting method |
Scanning cut by vibrating mirror + lens |
Maximum cutting accuracy |
±0.03mm |
CCD resolution |
500W (optional) |
X-axis travel |
600mm |
Y-axis travel |
700mm |
Z-axis travel |
100mm |
Maximum X/Y single-axis speed |
1000mm/s |
Working mode |
Manual loading and unloading |
Industrial vacuum system |
Standard |
File Format |
dxf format |
Cutting system |
SMIDA |
Main equipment power supply voltage |
220V/50Hz |
Working height |
900±30mm |
Industrial vacuum power supply |
220V/50Hz |
Equipment external size |
L1600*W1800*H2000mm |
Working environment |
Temperature: 25℃±2℃; humidity≤60%; no condensation |
Weight |
800kg |
Total power |
5.5kW |
Product advantages
Equipped with a high-speed scanning galvanometer, the equipment adopts a gantry structure, marble base and flying optical path design for the X/Y platform, delivering outstanding structural rigidity and long-term operational stability.
Supports optional picosecond UV laser, nanosecond UV laser and nanosecond green laser sources, featuring excellent beam quality, fine light spots, narrow kerfs and high cutting precision. The most efficient laser can be selected to balance processing effect and production capacity.
Adopts high-resolution branded CCD and professional optical lenses, enabling high-precision automatic positioning and focusing. It supports multiple visual positioning modes including cross marks, solid circles, hollow circles, L-shaped right-angle edges and image feature points.
Realizes full-process automation with automatic galvanometer correction and auto-focusing. Equipped with a laser displacement sensor, it can automatically calibrate the focus height relative to the workbench for fast alignment, saving operation time and labor.
Built-in professional fume extraction system completely removes cutting exhaust and smoke, protecting operators from harmful gas hazards and avoiding environmental pollution during production.
Product Application
Cutting of glass backlight panel, direct light panel, glass paint removal, electronic components, sapphire, camera module, glass enclosure, fingerprint module stainless steel reinforcement sheet, communication products, PCB (PCBA), FPC, aluminum substrate and other materials.
FAQ
Q: Which application fields does this laser micro-cutter cover?
A: It covers precision electronics, optical products, semiconductor packaging and circuit board processing fields.
Q: What applicable materials does this equipment support?
A: It supports fine cutting of optical glass, sapphire, various circuit boards, electronic modules, communication parts and etc.
Q: How flexible is the machine’s laser setup?
A: Different laser sources are available, and the power can be adjusted flexibly to meet diverse processing requirements.
